This page documents the Version 1, Revision 1 (V1R1) electronics design of the hyperspectral imager. If you are working on the firmware or integration of the HSI payload, you should find everything you need here.
Full Assembly
| Carrier Board | Carrier Board + Optics | Carrier Board + Optics + FPGA Board |
|---|---|---|
 |  |  |
Table 1: Renders of V1R1, fall 2017.
| PCB - Top View | Assembled PCB - Top View | PCB - Perspective |
|---|---|---|
 |  |  |
Table 2: Altium Designer Screenshot of production PCB, December 2017
| PCB without Components | PCB with components | Full camera assembly |
|---|---|---|
Table 3:Pictures of production PCB, January 2018
Technical Specification
System Design
Power Supply
To allow for maximum flexibility in development and testing (and unknown satellite provider) the V1R1 is designed for an input voltage of 5-18V, at 6A. Supplied with the prototype is a 12V, 4A, power supply for desktop use but we can solder on a connector for drone/balloon testing. The input voltage is connected to a switch-mode power supply module for maximum efficiency and then split into four different power rail for the image sensor and FGPA. The PicoZed board requires 5V, 3.3V and 1.8V and the image sensor 2.0V, 3.0V and 3.3V.
The main SMPS can be controlled through the external connector and shut of power to the entire connector. The four power rails will turn on in sequence after the PicoZed power supplies have turned on using the "Power Good" functionality of the regulators. When everything is up and running the microcontroller can check the power rails for the image sensor by reading pin xx.
List of important parts:
| PCBA Designator | Functionality | Part Number | Manufacturer | Specification | Datasheet |
|---|---|---|---|---|---|
Image Sensor
The image sensor used is a CMOSIS CMV2000. The data is read out using low voltage differential singling (LVDS) and controlled using SPI. For maximum quantum efficiency (QA), the variation of the sensor processed on 12um epitaxial (E12) SI wafer is used. The thicker epic-layer increases the sensitivity to light above 600nm significantly. Due to the sensitivity due to high speed data transfer, the data lines are carefully impedance matched following the TIA/EIA 644 standard for LVDS signals.
The following pin assignment on the PicoZed is used to control the CMV2000.
| PicoZed Pin | Functionality | Comment |
|---|---|---|
FPGA Interface
SD Card Interface
USB-UART Connection
USB 2.0 Connection
External Connector (Bus Connector)
JTAG Connector
Production Design Files
| Type | File | Kind | Comment |
|---|---|---|---|
| Schematic | Missing watermark + not made pretty yet. | ||
| Gerber | Gerber files sent to production, not that slots are in a separate drill file. | ||
| Altium Designer | Altium Designer 17 project files |