Novel Silicone Resin Binder and Compound for Thermally Highly Stressed Applications
DOI:
https://doi.org/10.5324/nordis.v27i1.4721Abstract
This paper deals with a new silicone resin compound that can be cured by addition curing and by peroxide curing, respectively. Curing and post-curing behavior has been investigated and optimized. Numerous trials towards the optimization of the binder-filler combinations have been performed. The resulting material POWERSIL® Resin 710 has been investigated with respect to its mechanical and thermal behavior. The new material exhibits heat class R and can be processed by press molding, pressure gelation, and injection molding.
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Copyright (c) 2022 Jens Lambrecht, Konrad Hindelang, Markus Winterer
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