The Role of Film Processing in the Large-Area Dielectric Breakdown Performance of Nano-Silica-BOPP Films

Authors

  • Ilkka Rytöluoto Tampere University of Technology Department of Electrical Engineering Tampere
  • Kari Lahti Tampere University of Technology Department of Electrical Engineering Tampere
  • Mikael Ritamäki Tampere University of Technology Department of Electrical Engineering Tampere
  • Mikka Karttunen

DOI:

https://doi.org/10.5324/nordis.v0i24.2286

Keywords:

Nano silica, BOPP, dielectric breakdown,

Abstract

This paper summarizes the effects of various compositional, structural and film processing factors on the breakdown behavior of laboratory- and pilot-scale melt-compounded bi-axially oriented polypropylene (BOPP) nanocomposite films with silica fillers. A selfhealing multi-breakdown measurement approach has been extensively utilized for large-area breakdown characterization of a large number of material variants from different processing trials. The results suggest that although the optimum level of silica presumably resides at the low fill-fraction range (~1 wt-%), the silica content itself is not the only determining factor, as compounds with equal silica content were found to exhibit large differences in the breakdown properties depending on the compounding and film processing steps. Dispersion quality and filler agglomeration (in both the nm- and μm-scale) appear to be of great importance. Indications of possible interaction between nano-silica and co-stabilizer Irgafos 168 are also presented. Overall, the laboratory- and pilot-scale film processing trials suggest that up-scaling of the polymer nanocomposite production is sensible with traditional melt-blending technology, although further development and optimization of nanocomposite formulations and processing is necessary.

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Published

2017-09-04

Issue

No. 24 (2015): Proceedings of the 24th Nordic Insulation Symposium

Section

Articles

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