2024

• Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis. (2024) Die-Level Series-Connection of SiC MOSFETs and Integration of Decoupling Capacitors. VDE Verlag GmbH
  Vitenskapelig Kapittel/Artikkel/Konferanseartikkel
• Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis. (2024) Gate driver, snubber and circuit design considerations for fast-switching series-connected SiC MOSFETs. IET Power Electronics
  Vitenskapelig artikkel
• Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis. (2024) Power Module Design with Chip-Level Series-Connected SiC MOSFETs. IEEE conference proceedings
  Vitenskapelig Kapittel/Artikkel/Konferanseartikkel
• Ubostad, Tobias Nieckula; Philipps, Daniel Alexander; Peftitsis, Dimosthenis. (2024) A Hybrid Current- and Voltage-Source Driver for Active Driving of Series-Connected SiC MOSFETs. IEEE transactions on power electronics
  Vitenskapelig artikkel

2023

• Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis. (2023) Design Considerations for Series-Connected SiC MOSFETs Operating at 100 kV/µs. IEEE conference proceedings
  Vitenskapelig Kapittel/Artikkel/Konferanseartikkel
• Philipps, Daniel Alexander; Xue, Peng; Ubostad, Tobias Nieckula; Iannuzzo, Francesco; Peftitsis, Dimosthenis. (2023) Low Inductive Characterization of Fast-Switching SiC MOSFETs and Active Gate Driver Units. IEEE transactions on industry applications
  Vitenskapelig artikkel
• Ubostad, Tobias Nieckula; Philipps, Daniel Alexander; Peftitsis, Dimosthenis. (2023) A Hybrid Current and Voltage-Source Gate Driver for Series-Connected SiC MOSFETs. IEEE conference proceedings
  Vitenskapelig Kapittel/Artikkel/Konferanseartikkel

2022

• Philipps, Daniel Alexander; Ubostad, Tobias; Peftitsis, Dimosthenis. (2022) Low Inductive Platform for Long- and Short-term Dynamic Charaterization of SiC MOSFETs. IEEE conference proceedings
  Vitenskapelig Kapittel/Artikkel/Konferanseartikkel

2021

• Ubostad, Tobias; Giannakis, Andreas; Rødal, Gard Lyng; Philipps, Daniel Alexander; Peftitsis, Dimosthenis. (2021) Reduction of Parasitic Inductance and Thermal Management in a Multichip SiC Half-Bridge Module. VDE Verlag GmbH
  Vitenskapelig Kapittel/Artikkel/Konferanseartikkel